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Ricoh R3111x Series Manual de usuario Pagina 24

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PACKAGE INFORMATION
PE-DFN(PLP)1010-4-071010
POWER DISSIPATION (DFN(PLP)1010-4)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plastic (Double sided)
Board Dimensions
40mm
× 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.54mm × 24pcs
Measurement Result (Topt=25°C, Tjmax=125°C)
Standard Land Pattern
Power Dissipation 400mW
Thermal Resistance
θja=(125−25°C)/0.4W=250°C/W
Thermal Resistance
θjc=67°C/W
0 50 10025 75 85 125 150
0
200
100
300
400
600
500
700
On Board
Ambient Temperature (°C)
Power Dissipation P
D
(mW)
40
40
Measurement Board Pattern
Power Dissipation
IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN
0.25
0.40
0.65
0.48
3-C0.18
0.48
1.30
0.47
0.22
45
(Unit: mm)
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